Facilities - equipment listing

Thermofisher Quattro S ESEM

• Electron Source: High-stability Schottky field emission gun.
• Electron Resolution: 0.7 nm at 30 keV, 1.4 nm at 1 keV.
• Everhart-Thornley secondary electron (SE) Detector, segmented solid-state backscatter electron (BSE) detector, and Low Vacuum (LVD) detector.
• In-chamber Nav-Cam sample navigation camera.
• Variable pressure operation.
• Environmental pressure operation (ESEM).
• Oxford AzTec Energy Dispersive X-ray Spectrometer (EDXS).
• Oxford Symmetry Electron Backscattered Detector (EBSD).
• Bruker PI88 Nanoindentor.

Book a Reservation/Equipment Availability - Request Training

IMSE Contact & Approved Trainers:

Dr. Huafang Li Hli40@wustl.edu
Dr. Tyrone Daulton TDaulton@wustl.edu

Training Materials:

ESEM Training Materials

Technical Information:

N/A

Access JEM-2100F Field-Emission STEM Training Materials

Training Contact: Dr. Huafang Li hli40@wustl.edu
Maintenance Contact: Dr. Tyrone Daulton tdaulton@physics.wustl.edu

• High brightness Schottky field emitter
• Resolution: 0.23 nm point-to-point, 0.1 nm lattice; high-resolution pole piece
• Bright field (BF), dark field (DF), and high-angle annular dark-field (HAADF) detectors
• High resolution lattice imaging (HRTEM)
• Bruker SDD Energy Dispersive X-ray Spectroscopy (EDXS) system
• Gatan Tridiem electron energy imaging filter (GIF) system for Electron  Energy Loss Spectroscopy (EELS)

Sign up calendars for the Major Instruments are found here.

• Electron Source: High-stability Schottky field emission gun
• Electron Resolution: 0.7 nm at 30 keV, 1.4 nm at 1 keV
• Ion Source: Sidewinder ion column
• Ion Resolution: 3.0 nm at 30 kV using selective edge method
• Everhart-Thornley secondary electron (SE) Detector and retractable, segmented solid-state backscatter electron (BSE) detector
• Platinum Gas injection
• Thermo Scientific EasyLift system for in situ sample manipulation
• FIB charge neutralizer
• In-chamber Nav-Cam sample navigation camera
• Variable pressure operation

Sign up calendars for the Major Instruments are found here. 

Training Request

Access 2100 TEM Training Materials

Primary points of contact:
New User Training: Dr. Huafang Li hli40@wustl.edu
Maintenance: Dr. Tyrone Daulton tdaulton@physics.wustl.edu

• LaB6 Emitter
• ThermoNoran Energy Dispersive X-ray Spectroscopy (EDXS) system
• Gatan Model 666 parallel electron energy loss spectrometer (PEELS) system

Sign up calendars for the Major Instruments are found here.

Contact: Dr. Huafang Li hli40@wustl.edu
314-935-8701 

• Temperature-dependent mechanical property measurement (max. applied load 1 N) up to 1100 °C
• Measure the thermal expansion of solid samples with 5 nm resolution
• Detect phase transformations, including amorphous-crystalline, crystalline-crystalline and melting events

Contact: Dr. Tyrone Daulton tdaulton@wustl.edu
314-935-4537

• Cu K-alpha x-ray source
• 1.5 kV power supply
• Special attachment for limited high temperature operation

The Atomic Layer Deposition (ALD) system from Veeco (Model Savannah S100 Thermal ALD) can deposit several different kinds of materials with high conformality and at an atomic level (Angstrom) thickness control. Films can be deposited at up to 400 C. Currently, IMSE provides the capability of Al2O3 using Trimethyl Aluminum (TMA) precursor and water as co-reactants in the Al2O3 ALD process. Three additional precursors can be installed at same time on the instrument. Users are allowed to bring their own precursors. IMSE also provides the capability to measure thin film properties using ellipsometry, profilometry, SEM, TEM, XPS, resistivity, etc.

The Disco DAD323 dicing saw can be used to cut a variety of materials such as silicon, glass, sapphire, etc. The substrate size is limited to 150 mm diameter and height to less than 5 mm. The rotating high speed blade makes a precise cut through the substrate which is mounted on adhesive tape. Samples should be able to withstand a high flow of water (water is used to keep the blade from getting hot). The instrument can run in manual mode or automatic mode to make repetitive cuts at precise spacing.

IMSE provides standard blades for cutting most types of materials and the cost is included in the instrument charges. Users are also allowed to bring their own. Currently, IMSE staff is responsible for changing the blades for all users.

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IMSE Contact & Approved Trainer:
Dr. Tyrone Daulton (tdaulton@wustl.edu)  

Training Documents:
Operating Instructions NOTE: User must demonstrate skills to IMSE staff before independent use.

Recipe:
N/A

Technical Info:
Instrument Specifications
Disco Blade Z09 Specifications
Disco Blade R07 Specifications

The J.A. Woollam alpha-SE ellipsometer can measure film properties non destructively. Some of the film properties include optical constants, film thickness and roughness. The change in polarized light properties during the measurement can measure film thickness from micrometer length scales down to angstrom length scales precisely. The instrument is typically used for dielectric, semiconductor and organic thin films.

The instrument has a wavelength range from 380 nm - 900 nm, and can operate at three angles (65, 70 and 75 degrees) in manual mode.

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Recipe:
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Technical Info:
Instrument Specifications

The Photolithography process transfers the patterned features from the mask on to the thin photoresist layer spin coated on silicon wafer. The Karl Suss MJB3 UV 400 mask aligner can provide a resolution down to 0.6 micrometer in optimal conditions. Considering the age of instrument, features size greater than 1 micrometer are reliably achievable. Photoresist layer thickness can be varied from sub micrometer to more than 200 micrometer depending on the photoresist material, spin coating speed and other process conditions. Selected photoresists (S1805 and SU-8 2050) are sold by IMSE in small quantities.

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IMSE Contact & Approved Trainer:


Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions

Recipe:
Click here to see existing recipes

Technical Info:
AZP4620 Resist datasheet
KL IR 15 Resist datasheet
S1805 Resist datasheet
SU8-2025 Resist datasheet
SU8-2050 Resist datasheet

An easy to use UV-LED mask aligner that can perform photolithography on substrates  up to 4" diameter and with resolution as small as 2 microns. Front-side alignment can now be performed with joypad controls in a matter of minutes. It can be useful in many research applications not limiting it to microelectronics, microfluidics, optics & photonics.

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IMSE Contact & Approved Trainer:


Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions

Recipe:
N/A

Technical Info:
Instrument Specifications
AZP4620 Resist datasheet
KL IR 15 Resist datasheet
S1805 Resist datasheet
SU8-2025 Resist datasheet
SU8-2050 Resist datasheet

Oxford Instrument's Nanofab provides the capability to deposit thin films of SiO2, SiN, p-Si, a-Si, Graphene, Nanotubes, etc. The standard gasses connected to the instrument are Ar, N2O, N2, CH4, 2%SiH4 in Ar, NH3, and H2. For more process capability, please contact IMSE staff.

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IMSE Contact & Approved Trainer:


Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions

Recipe:
Click here to see existing recipes

Technical Info:
Instrument Specifications

The SCS Parylene Deposition system (Model PDS 2010) can coat a very uniform coating of parylene film over a wide variety of substrates maintained at room temperature. The IMSE is currently providing Parylene-C dimer, however, other Parylene dimers can be explored in the system. It is used in a wide range of applications, including circuit boards, sensors, wafers, medical devices and elastomeric components for research, development and repair. This system is located in Rudolph Hall, L27, outside of the cleanroom.

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IMSE Contact & Approved Trainer:


Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions

Recipe:
N/A

Technical Info:
Instrument Specifications

​​​​​​​The Signatone S-1008 Probe station can be used to precisely measure substrate (or thin film on substrate) electrical properties using the Keithley 238 Source Measure Unit. Probes can be placed with sub-100 micron precision. 2-wire and 4-wire measurements are available. Probes are adjustable to meet different substrate size requirements. LCR 800 meter is also available for measuring additional electrical properties. Measurements can be taken in manual and automated manner.

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IMSE Contact & Approved Trainer:


Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating Instructions

Recipe:
N/A

Technical Info:
Keithley 238 Manual
LCR 800 manual

The KLA Tencor D-100 series profilometer measures the 2D surface topography, step height and thin film stress by using a stylus in close contact with the surface while maintaining the set force between the stylus and surface. 2D profiles can scan up to 30 mm in length. The technique is usually non-destructive except for very soft organic material based films.

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IMSE Contact & Approved Trainer:


Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions

Recipe:
N/A

Technical Info:
Instrument Specifications

Oxford Instrument's Plasma Lab 100 System provides the capability to etch features on silicon wafers using plasma based gas chemistries. The instrument has dual source plasma: Inductive Couple Plasma (ICP) on top chamber and Reactive Ion Plasma source on Substrate. The tool has the ability to run ICP based deep Si etch processes. The standard gasses connected to the instrument are Ar, O2, He, CHF3, SF6, NF3, H2 and CH4.

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Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions

Recipe:
Click here to see the current recipes

Technical Info:
N/A

The Brewer Science CEE 200X Spin Coater, located in Solvent Fume hood(1), can spin up to 6000 rpm with high accuracy and repeatability. The Windows based touch screen interface is highly user friendly to operate. Typically, it is used for Photolithography processes to deposit uniform film thickness on silicon substrate from few 10's of nanometer to 100's of micrometer depending on the selected resist material.

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IMSE Contact & Approved Trainer:


Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions
Training Videos

Recipe:
Click here to see existing recipes

Technical Info:
Safety Data Sheets of chemicals
AZP4620 Resist datasheet
KL IR 15 Resist datasheet
S1805 Resist datasheet
SU8-2025 Resist datasheet
SU8-2050 Resist datasheet
MCC Primer 80/20
950 PMMA A8

The Kurt Lesker PVD 75 Physical Vapor Deposition system allows material deposition on substrates by sputtering material from a solid source (also called "target" material). A plasma based Ar sputtering process is used to deposit material of desired thickness at ~0.5 nm/s growth rates. In addition, reactive gases such as oxygen can be added to deposit oxides form of solid source material. Available target materials are: Al, SiO2, Niobium, SiN, ZnO, Cu, Zn, Ti. In addition, substrate can be heated to control deposited film properties.

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IMSE Contact & Approved Trainer:


Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions
Training Videos

Recipe:
Click here to see existing recipes

Technical Info:
Quartz Crystal Microbalance (QCM) — Read Section 7.3 for calibration procedure and Appendix A for parameters for selected material.

The Edwards Auto 306 Vacuum coater deposits material in vacuum conditions by heating the source material. Films have low impurity due to high vacuum conditions. Growth rates are typically ~0.1 nm/s. Up to four materials can be deposited in-situ without breaking the vacuum. Users are expected to provide their own consumables, including boats and source materials.

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Request Training

IMSE Contact & Approved Trainer:


Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions

Recipe:
Click here to see the current recipes

Technical Info:
Quartz Crystal Microbalance (QCM) — Read Section 7.3 for calibration procedure and Appendix A for parameters for selected material.

​​​​​​​ Lindberg tube (glass)furnace can be heated up to 1100 C to grow oxide on silicon wafer under ambient conditions. Furnace is run in batch conditions. Typical SiO2 growth on Silicon substrate is ~430 nm for 15 hr run and ~820 nm for 80 hr run at 1100 C.

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Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating Instructions
Training Videos


Recipe:
Click here to see available recipes

Technical Info:
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​​​​​​​UVOCS UV based Ozone cleaner is used to clean remaining small residues on thin films surfaces such as silicon, gold and aluminum under ambient conditions. Cleaned surfaces can also be used to improve adhesion in certain processes. This is not meant to remove gross resist or organic surfaces with thickness greater than 100 nm. Gross material should be removed with wet chemistries. Certain halide residues are not allowed as they could corrode the interior parts.

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Recipe:
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Technical Info:
Instrument features